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Copper Pillar (also known as Copper Post Bump) is a vertical interconnect structure used in advanced semiconductor packaging, where copper columns are formed on the die to enable fine-pitch, high-density connections to the substrate or interposer.
Copper Post / Cu Post
Height - 50~150㎛ Diameter - 60~200㎛ Pitch - 100~300㎛ Coplanarity - ±2㎛ Thickness - 0.40 ~ 2.0mm
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