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An automated system used to inspect the appearance of a product using a high-resolution camera and lighting system in the final stages of PCB or semiconductor packaging production. It replaces manual visual inspection to ensure quality and defect-free delivery. This equipment is important for inspecting high-density circuits in areas that are difficult to detect with the naked eye, such as Au or OSP-treated pads, and in bonding pads measuring 10μm.
automated system used in the final stage of PCB or semiconductor packaging production to inspect the product’s external appearance and 3D structure with high precision
At DMT, we uncover the smallest details to create the greatest value.
