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Flip Chip – Board on Chip (BoC) refers to a packaging technology where the substrate is mounted directly over the semiconductor die, enabling a highly integrated and space-efficient package architecture.
Board on Chip (BOC)
Pattern - 15~30㎛ Pattern Space - 15~30㎛ Thickness - 0.40 ~ 2.0mm
At DMT, we uncover the smallest details to create the greatest value.
