Using DI WATER, the PCB rinse equipment is designed to thoroughly clean the printed circuit board (PCB) by removing chemical residues, particles, and contaminants left from various manufacturing processes. Ensure surface cleanliness and prepare the board for subsequent steps such as inspection, soldering, or coating.
Supported Devices
FC (Flip Chip), Board on Chip (BOC), CSP (Chip Scale Package) FC-CSP, FC-BGA, SiP (System in Package)
Resolution
Purity: ≥10 MΩ
(Magazine type compatible)
Temperature - Up to 80°C (rinse), up to 120°C (drying)
Ultrasonic Frequency - 36khz / 40±5%(1500w)
Supported Devices - FC(Flip Chip), BOC(Board on Chip), CSP(Chip Scale Package), FC-CSP, FC-BGA, SiP(System in Package)
