F to F
This equipment is designed to automatically measure and sort printed circuit boards (PCBs) based on predefined dimensional criteria such as thickness, warpage, or overall scale. It plays a key role in maintaining production quality and consistency across high-volume manufacturing lines.
Supported Devices
FC (Flip Chip), Board on Chip (BOC), CSP (Chip Scale Package)
FC-CSP, FC-BGA, SiP (System in Package)
