Warpage

PCB Warpage Measurement Equipment This equipment is designed to detect and classify warpage (bending or distortion) in printed circuit boards (PCBs), which can occur due to heat exposure, material stress, or manufacturing inconsistencies. Warpage can lead to serious defects in electronic assemblies, making accurate measurement essential for quality assurance.

Supported Devices

FC (Flip Chip), Board on Chip (BOC), CSP (Chip Scale Package)
FC-CSP, FC-BGA, SiP (System in Package)