AFVI 2D
The PCB AFVI 2D equipment is designed to automatically inspect printed circuit boards (PCBs) using high-resolution 2D imaging technology. Powered by AI-based defect detection algorithms, it identifies surface-level defects before packaging or shipping and performs a final visual inspection to ensure product quality.
Supported Devices
FC (Flip Chip), Board on Chip (BOC), CSP (Chip Scale Package)
FC-CSP, FC-BGA, SiP (System in Package)
