AFVI 3D
PCB Unit AFVI 3D Equipment is a high-precision inspection system designed to automatically inspect individual printed circuit boards (PCBs) using 3D imaging technology. It performs final visual checks to detect surface defects, solder joint issues, and component misalignments with exceptional accuracy.
Supported Devices
FC (Flip Chip), Board on Chip (BOC), CSP (Chip Scale Package)
FC-CSP, FC-BGA, SiP (System in Package)
